Applied Materials, Inc. Q1 FY2024 Earnings Call
· Earnings call transcript and AI-powered summary
Overview
- Applied Materials reported a strong start to fiscal 2024, with revenue at the high end of guidance and EPS above guidance.
- Management emphasized continued outperformance versus the broader wafer fab equipment (WFE) market for the fifth consecutive year.
- Major growth drivers include DRAM (especially high-bandwidth memory), advanced packaging, gate-all-around transistor adoption, and ICAPS markets (IoT, communications, automotive, power, sensors).
Market Environment & Business Trends
- Customer sentiment improving across semiconductors: increasing fab utilization, normalizing memory inventory, and renewed investment among cloud players.
- Leading-edge foundry-logic expected to be stronger year-over-year, though certain projects are delayed.
- ICAPS market to be slightly weaker than 2023, following two years of extraordinary growth, but supported by regional investments.
- DRAM continues to strengthen, driven by rapid HBM adoption. NAND expected to improve from 2023 lows but remains under 10% of total WFE.
Key Technology Growth Drivers
- High-Bandwidth Memory (HBM): Expected to grow at a 50% CAGR, driven by AI data center demand. HBM packaging revenue expected to quadruple year-over-year to nearly $0.5B in FY2024. Total advanced packaging revenue expected at ~$1.5B.
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